Business Samsung tops capacity rankings

Business Samsung tops capacity rankings

2014/01/09

Samsung has more IC manufacturing capacity than anyone else, says IC Insights, with 1.9 million 200mm equivalent wpm representing 12.6% of the world’s capacity.

Next is TSMC with 1.5 million wpm or 10.0% of total worldwide capacity.

Following TSMC were Micron, Toshiba/SanDisk, and Hynix.

The three largest pure-play foundries—TSMC, GlobalFoundries, and UMC—are ranked have about 80% of the foundry market and 17% of the total fab capacity in the world.

Top Ten Capacity Companies
Measured in millions of wpm.

Samsung 1.9
TSMC. 1.5
Micron 1.4
Toshiba. 1.2
Hynix 1.0
Intel. 0.96
ST. 0.55
UMC. 0.52
GloFo. 0.48
TI. 0.44

The combined capacity of the top-5 leaders accounted for 47% of total worldwide capacity in Dec-2013.

At the same time, just over two-thirds (67%) of the world’s capacity was represented by the combined capacity of the top-10 leaders, while the top 15 accounted for 76% and the top 25, 85%, of worldwide installed IC capacity in Dec-2013.

The shares of these groups have each increased significantly since 2009.

The top-5 group gained 11 percentage points; the top-10 group, 13 points; the top-15 group, 12 points; and the top-25 group, seven points.  Those are big gains over the course of just four years!

IC manufacturing is increasingly becoming a high stakes poker game with enormous up-front costs.

Today, it costs $4.0-$5.0 billion for a high-volume state-of-the-art 300mm wafer fab and the cost to build tomorrow’s 450mm wafer fab will probably be double that.  Despite the cost-per-unit area advantage that larger wafers provide, there are fewer and fewer companies willing and able to continue investing that kind of money.

IC Insights believes that the capacity shares of the top 5, 10, 15, and 25 leaders will continue to increase over the next several years as the big get bigger, middle-tier manufacturers merge to consolidate resources and improve competitiveness, and a greater number of mid- to small-size companies move away from in-house IC fabrication and move toward using third-party foundries.

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